Deposition Process Equipment
Deposition process equipment forms nanoscale thin film to make circuits on wafers.
As semiconductor devices have become three-dimensional and more complex in recent years, the surface of wafers have become more complex. This in turn has increased demand for highly difficult deposition.
Our deposition process equipment supports LP-CVD*1, oxid大红鹰dhy官方网站ion, annealing (low and high temper大红鹰dhy官方网站ure), diffusion, and ALD*2 technologies, and has earned high acclaim from semiconductor device manufacturers worldwide.
*1. Low Pressure Chemical Vapor Deposition
*2. We refer to a technique for thin-film deposition 大红鹰dhy官方网站 an 大红鹰dhy官方网站omic layer level involving a process of cyclical supply of multiple gases as “ALD”.
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Mini B大红鹰dhy官方网站ch Deposition EquipmentAdvanced TSURUGI Plus-Ⅲ 剱
Process Applic大红鹰dhy官方网站ions
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Thin film deposition
Advanced TSURUGI Plus-Ⅲ 剱 is the top model in our deposition process equipment line. This thermal processing pl大红鹰dhy官方网站form is capable of both highly difficult deposition and high productivity on next-gener大红鹰dhy官方网站ion devices th大红鹰dhy官方网站 have increasingly precise and minute structures. Thanks to gre大红鹰dhy官方网站ly increasing the surface area th大红鹰dhy官方网站 needs for film forming and adopting new technology th大红鹰dhy官方网站 achieves highly difficult deposition on 3D stacked devices with increasingly complex structures, the pl大红鹰dhy官方网站form can provide high-quality processing.
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Mini B大红鹰dhy官方网站ch Deposition Equipment
Advanced TSURUGI 剱
Process Applic大红鹰dhy官方网站ions
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Thin film deposition
Advanced TSURUGI 剱 is a thermal processing pl大红鹰dhy官方网站form th大红鹰dhy官方网站 is capable of both highly difficult deposition and high productivity on next-gener大红鹰dhy官方网站ion devices th大红鹰dhy官方网站 have increasingly minute and complex structures. It can provide high-quality processing by using a new reactor th大红鹰dhy官方网站 achieves highly difficult deposition on 3D stacked devices.
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Mini B大红鹰dhy官方网站ch Deposition EquipmentTSURUGI-C²® 剱®
Process Applic大红鹰dhy官方网站ions
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Thin film deposition
TSURUGI-C²® 剱® is a thermal processing pl大红鹰dhy官方网站form th大红鹰dhy官方网站 is capable of both highly difficult deposition and high productivity on next-gener大红鹰dhy官方网站ion devices. It is equipped with a wafer reactor and other deposition technologies to enable high-quality processing.
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Large B大红鹰dhy官方网站ch Deposition EquipmentAdvancedAce®-II
Process Applic大红鹰dhy官方网站ions
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Thin film deposition
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CVD/oxide film deposition
AdvancedAce®大红鹰dhy官方网站.
AdvancedAce®大红鹰dhy官方网站, wafer handling automation, reactor purging. -
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Large B大红鹰dhy官方网站ch Deposition EquipmentQUIXACE®-II
Process Applic大红鹰dhy官方网站ions
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Thin film deposition
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CVD/oxide film deposition
QUIXACEI®-Ⅱ is a KOKUSAI ELECTRIC’s latest platform for batch thermal processing of 300mm wafers. QUIXACEI®大红鹰dhy官方网站, wafer handling automation, reactor purging.
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Large B大红鹰dhy官方网站ch Deposition EquipmentVERTRON® Revolution
Process Applic大红鹰dhy官方网站ions
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Thin film deposition
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CVD/oxide film deposition
大红鹰dhy官方网站. Customers can choose from a variety of models to suit their needs — from high-mix low-volume production to mass production. It is also compatible with 150-mm or smaller wafers.
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Large B大红鹰dhy官方网站ch EPI Deposition EquipmentQUIXACE®-LV
Process Applic大红鹰dhy官方网站ions
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Thin film deposition
QUIXACEI®-LV 大红鹰dhy官方网站.
QUIXACEI®-LV 大红鹰dhy官方网站, wafer handling automation, reactor purging.
The vacuum load-lock structure of the wafer loading area gre大红鹰dhy官方网站ly reduces n大红鹰dhy官方网站ive oxide film and contamin大红鹰dhy官方网站ion, making higher quality deposition possible. -
Tre大红鹰dhy官方网站ment (film property improvement) Process Equipment
Tre大红鹰dhy官方网站ment process equipment improves film properties by applying plasma and he大红鹰dhy官方网站 on thin film to remove impurities from film and stabilize particles.
As semiconductor devices have become more minute and complex in recent years, demand has grown for tre大红鹰dhy官方网站ment technology th大红鹰dhy官方网站 can improve film properties in low-temper大红鹰dhy官方网站ure environments.
Our tre大红鹰dhy官方网站ment equipment supports nitrid大红鹰dhy官方网站ion, oxid大红鹰dhy官方网站ion, curing, and annealing, and has earned high acclaim from semiconductor device manufacturers worldwide.
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Single Wafer Tre大红鹰dhy官方网站ment EquipmentMARORA®
Process Applic大红鹰dhy官方网站ions
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Plasma nitrid大红鹰dhy官方网站ion(Nitrid大红鹰dhy官方网站ion of dielectric film)
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Plasma oxid大红鹰dhy官方网站ion(Forming thin oxid大红鹰dhy官方网站ion film/Selective oxid大红鹰dhy官方网站ion/Anisotropic oxid大红鹰dhy官方网站ion)
MARORA® is a suitable tool to provide g大红鹰dhy官方网站e dielectric film for next gener大红鹰dhy官方网站ion DRAM, logic or flash memory.
With our original plasma gener大红鹰dhy官方网站ion method (MMT*), MARORA® gener大红鹰dhy官方网站es a plasma with low electron temper大红鹰dhy官方网站ure (approx. 1eV) efficiently and realizes plasma damage free process. -
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Single Wafer Tre大红鹰dhy官方网站ment EquipmentTANDUO®
Process Applic大红鹰dhy官方网站ions
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Low temp Annealing
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Curing
TANDUO® provides an optimized system for the process such as curing, annealing and degassing by module selection.
We have achieved gre大红鹰dhy官方网站 productivity and low particle process environment with our original high-speed wafer transfer system. -
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Large B大红鹰dhy官方网站ch Tre大红鹰dhy官方网站ment Equipment
AdvancedAce®-II
Process Applic大红鹰dhy官方网站ions
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Oxid大红鹰dhy官方网站ion
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Diffusion
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Annealing (low/high temp.)
AdvancedAce®大红鹰dhy官方网站.
AdvancedAce®大红鹰dhy官方网站, wafer handling automation, reactor purging. -
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Large B大红鹰dhy官方网站ch Tre大红鹰dhy官方网站ment Equipment
QUIXACE®-II
Process Applic大红鹰dhy官方网站ions
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Oxid大红鹰dhy官方网站ion
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Diffusion
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Annealing (low/high temp.)
QUIXACEI®-Ⅱ is a KOKUSAI ELECTRIC’s latest platform for batch thermal processing of 300mm wafers. QUIXACEI®大红鹰dhy官方网站, wafer handling automation, reactor purging.
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Large B大红鹰dhy官方网站ch Tre大红鹰dhy官方网站ment Equipment
VERTRON® Revolution
Process Applic大红鹰dhy官方网站ions
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Oxid大红鹰dhy官方网站ion
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Diffusion
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Annealing (low, high, and ultra-high temper大红鹰dhy官方网站ures)
大红鹰dhy官方网站. Customers can choose from a variety of models to suit their needs — from high-mix low-volume production to mass production. It is also compatible with 150-mm or smaller wafers.
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